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Home For Work IC Handler IC Handler Epson NX1032XS IC Test Handler

Epson NX1032XS IC Test Handler

Product Models displayed on this website may be available in certain regions only.

Engineered to Deliver the Most Reliable and Accurate Handler

Developed using leading-edge robot technology, this IC test handler boasts significantly improved performance to support even the most demanding tests.

    • Up to 32 site testing capability
      Testing area from 344mm x 244mm
      Up to 430kgf contact force
      UPH - up to 20,000 (Ambient) & 
      Up to 10,500 (High Temperature)

Simultaneous Multi-site Tests
Maximum throughput of up to 20,000 chips per hour with simultaneous multi-site tests for 32 IC devices and high contact force of up to 4,800N.
 
Test Hand-independent Heat Press Method
Test chips at temperatures as high as 155°C and reduce jam recovery time.
 
Convenient Compatibility
Compatible with a wide range of changeover kits for the existing NS series (including adapter compatible changeover kits).

Devices Handled:


Devices Handled: 16-site | 32-site
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA, Min. 3×3 to Max. 50×50 (Lead pitch: 0.4mm or more) *1

Test Mode:


Test Mode: N/A | 32-site (8×4, X: 40mm pitch × Y: 60mm pitch)
16-site (8×2, X: 30mm pitch Y: 60mm pitch, 40mm pitch × Y: 60mm pitch)
8-site (4×2, X: 40mm pitch × Y: 60mm, X: 60mm pitch × Y: 60mm, X: 80mm pitch × Y: 60mm)
4-site (2×2, X: 80mm × Y: 60mm), (4×1, X: 40mm, 60mm, 80mm)
2-site (Socket pitch 80 mm)
Single (use one side of the 2-site test)
Non-standard pitches can be set by laying out the independent compliance unit with desired pitches

Testing Area:


Testing Area: 344 × 146 mm | 344 × 244 mm

Standard Socket Pitch (mm):


Standard Socket Pitch (mm): X: 40mm Y: 60mm

Heating Method:


Heating Method: Heat Press Method

Index Time:


Index Time *2 (common in Ambient and High Temperature modes): Min. 0.38sec.
Approx. 0.42sec. (wide 4×2, 8×2 layout) | Approx. 2.05sec. (8×4 layout)
Approx. 2.21sec. (4,800N Option) | Approx. 4.35sec. (4,800N Option)

Max. Contact Force:


Max. Contact Force: 1,600N (Optional) or 4,800N (Standard) | 3,200N (Optional) or 4,800N (Standard)

Maximum Throughput (units per hour):


Ambient Temperature: 8×4 and 8×2 layouts: 20,000, 4×2 layout: 15,000High Temperature: 8×4 and 8×2 layouts: 10,500, 4×2 layout:10,500

Binning:


Binning: Max. 6 bins (Auto 3, Manual 3)

Tray:


Tray: JEDEC (135.9 × 315.0 mm)

Temperature Accuracy:


Temperature Accuracy: 50 - 90°C ±2°C
90 - 155°C ±3°C

Hot Plate Size:


Hot Plate Size: 220 × 380 mm *3

Handler Dimensions (D x W x H):


Handler Dimensions (D x W x H): 1,580 x 1,940 x 2,000 mm *4

Weight:


Weight: Approx. 1,200kg

Power Requirements:


Rated Voltage/Frequency/Current: Single Phase 200 - 240 V AC, 50/60 Hz, 6 kVA